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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11111384 B1

PDFFull Text
Date of Patent:
Sep. 07, 2021

Filed:

Jul. 29, 2019

Polyamide resin composition for blow-molded products exposed to high-pressure hydrogen, and blow-molded product

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Shinichiro Ochiai, Nagoya, JP;

Shota Suzuki, Nagoya, JP;

Sadayuki Kobayashi, Nagoya, JP;

Assignee:

Toray Industries, Inc., Tokyo, JP;

Attorney:

DLA Piper LLP (US)

Primary Examiner:

Robert D Harlan

Int. Cl.
CPC ...
C08L 77/02 (2006.01); C08K 3/16 (2006.01); C08F 222/06 (2006.01); B29C 49/04 (2006.01); B29C 49/00 (2006.01); F17C 1/16 (2006.01); C08L 23/26 (2006.01); B29K 77/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
C08L 77/02 (2013.01); B29C 49/0005 (2013.01); B29C 49/04 (2013.01); C08F 222/06 (2013.01); C08K 3/16 (2013.01); C08L 23/26 (2013.01); F17C 1/16 (2013.01); B29K 2077/00 (2013.01); B29K 2995/0089 (2013.01); B29L 2031/7156 (2013.01); C08L 2203/30 (2013.01); F17C 2203/0604 (2013.01); F17C 2203/066 (2013.01); F17C 2209/2127 (2013.01); F17C 2221/012 (2013.01);
Abstract

A polyamide resin composition for a blow-molded article exposed to high-pressure hydrogen gas contains: 70 to 99 parts by weight of a polyamide 6 resin (A); 1 to 30 parts by weight of an impact modifier (B); and 0.005 to 1 parts by weight of a metal halide (C) with respect to a total of 100 parts by weight of the polyamide 6 resin (A) and the impact modifier (B). The polyamide resin composition has a melt tension of 20 mN or more when measured at 260° C. and a take-up speed at strand break of 50 m/min or more when measured at 260° C.

Find Patent Forward Citations

Ochiai, Shinichiro. (2021). Polyamide resin composition for blow-molded products exposed to high-pressure hydrogen, and blow-molded product (U.S. Patent No. 11111384). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11111384

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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