The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Dec. 04, 2019
Applicant:

Elite Material Co., Ltd., Taoyuan, TW;

Inventor:

Shu-Hao Chang, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); C08F 212/36 (2006.01); C08L 67/00 (2006.01); C08L 77/00 (2006.01); C08L 33/08 (2006.01); C08L 33/24 (2006.01); C08K 5/01 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); C08F 212/36 (2013.01); C08J 5/24 (2013.01); C08K 5/01 (2013.01); C08L 33/08 (2013.01); C08L 33/24 (2013.01); C08L 63/00 (2013.01); C08L 67/00 (2013.01); C08L 77/00 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01);
Abstract

A resin composition comprises: a vinyl-containing polyphenylene ether resin, a bis(vinylphenyl)ethane and a modification of divinylbenzene. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dielectric constant, dissipation factor, copper foil peeling strength, glass transition temperature, ratio of thermal expansion, thermal expansion coefficient, precipitation property of varnish, solder dipping thermal resistance, solder floating thermal resistance of multi-layer board, reflow thermal resistance of multi-layer board and T300 thermal resistance.


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