The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Mar. 20, 2018
Applicants:
Kyocera Corporation, Kyoto, JP;
The University of Tokyo, Tokyo, JP;
Inventors:
Masayuki Kyomoto, Kyoto, JP;
Kazuhiko Ishihara, Tokyo, JP;
Assignees:
KYOCERA CORPORATION, Kyoto, JP;
THE UNIVERSITY OF TOKYO, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/06 (2006.01); C08L 33/10 (2006.01); C08L 43/02 (2006.01); C08L 23/12 (2006.01);
U.S. Cl.
CPC ...
C08L 23/06 (2013.01); C08L 23/12 (2013.01); C08L 33/10 (2013.01); C08L 43/02 (2013.01); C08L 2207/14 (2013.01);
Abstract
A resin molded body includes: a polyolefin element formed of polyolefin, including a crystalline region and an amorphous region; and a hydrophilic copolymer contained in at least part of a surface of the polyolefin element, the hydrophilic copolymer including a copolymer of 2-methacryloyloxyethyl phosphorylcholine (MPC) of 45% or greater on a mole fraction basis and at least one other monomer. In the resin molded body, the MPC polymer is immersed through the surface by applying heat treatment.