The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Sep. 19, 2017
Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Tomonori Kato, Kanagawa, JP;

Kenji Kouno, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/06 (2006.01); B65D 1/02 (2006.01); C08J 3/20 (2006.01); B29C 49/00 (2006.01); B29K 23/00 (2006.01); B29K 77/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
C08L 23/06 (2013.01); B65D 1/0207 (2013.01); C08J 3/201 (2013.01); B29C 49/0005 (2013.01); B29K 2023/065 (2013.01); B29K 2077/00 (2013.01); B29L 2031/712 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); C08L 2207/062 (2013.01);
Abstract

A polyolefin-based structure includes 60 to 97% by mass of a polyolefin (A), 1 to 35% by mass of an acid-modified polyolefin (B), and 2 to 35% by mass of a polyamide resin (C), in which the polyamide resin (C) is dispersed in a layered form in the polyolefin (A), and the polyamide resin (C) is a melt-kneaded product of 30 to 70% by mass of a polyamide (X) that contains a diamine unit containing 70 mol % or more of a m-xylylenediamine unit and a dicarboxylic acid unit containing an α,ω-linear aliphatic dicarboxylic acid unit and 30 to 70% by mass of an aliphatic polyamide (Y) (provided that a total of the polyamide (X) and the polyamide (Y) is taken as 100% by mass), and a difference between a melting point Tmof the polyamide (X) as observed by differential scanning calorimetry and a melting point Tmderived from the polyamide (X) in the polyamide resin (C), is 0.1 to 2.5° C.


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