The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Dec. 08, 2014
Applicant:
Kyoraku Co., Ltd., Kyoto, JP;
Inventors:
Masaaki Onodera, Yamato, JP;
Takeru Sano, Yamato, JP;
Assignee:
KYORAKU CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/00 (2006.01); C08J 9/12 (2006.01); B29C 49/00 (2006.01); B29K 23/00 (2006.01); B29K 105/04 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
C08J 9/0061 (2013.01); B29C 49/0005 (2013.01); C08J 9/122 (2013.01); B29K 2023/065 (2013.01); B29K 2023/0633 (2013.01); B29K 2105/04 (2013.01); B29L 2031/30 (2013.01); C08J 2201/03 (2013.01); C08J 2203/06 (2013.01); C08J 2203/08 (2013.01); C08J 2205/052 (2013.01); C08J 2207/00 (2013.01); C08J 2323/06 (2013.01); C08J 2423/06 (2013.01);
Abstract
A molded foam that can be easily taken out of split mold blocks is provided. According to an aspect of the present disclosure, a molded foam is obtained by clamping, with split mold blocks, foamed resin obtained by melting and kneading a polyethylene-based resin, wherein the molded foam has a MFR (190° C., g/10 min) of less than 0.8, or the polyethylene-based resin has a MFR (190° C., g/10 min) of not more than 1.0.