The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Nov. 08, 2018
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Hee Kwang Park, Daejeon, KR;
Byung Seok Kim, Daejeon, KR;
Kyung Seop Noh, Daejeon, KR;
Sang Jin Jeon, Daejeon, KR;
Seong Min Chae, Daejeon, KR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
C08F 110/06 (2006.01); C08F 4/659 (2006.01); C08F 4/76 (2006.01); D04H 1/4291 (2012.01); C08F 2/02 (2006.01); C08F 4/6592 (2006.01);
U.S. Cl.
CPC ...
C08F 110/06 (2013.01); D04H 1/4291 (2013.01); C08F 2/02 (2013.01); C08F 4/65927 (2013.01); C08F 2420/01 (2013.01);
Abstract
The present invention relates to homopolypropylene resin for non-woven fabric, and according to the present invention, by optimizing tacticity to 80% to 90%, having narrow molecular weight distribution of 2.4 or less, and fulfilling melt index of 20 g/10 min to 30 g/10 min, melting point of 145° C. or less, and residual stress rate of 0.05% or less, thereby optimizing modulus, high strength non-woven fabric that is softer than the existing products, and is not easily torn due to high tenacity, can be prepared.