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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11110685 B1

PDFFull Text
Date of Patent:
Sep. 07, 2021

Filed:

Nov. 30, 2017

Integrally molded body and method of producing same

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Hideaki Sasaki, Nagoya, JP;

Yuki Takahashi, Nagoya, JP;

Keisuke Shiozaki, Nagoya, JP;

Assignee:

Toray Industries, Inc., Tokyo, JP;

Attorney:

DLA Piper LLP (US)

Primary Examiner:

Catherine A Simone

Int. Cl.
CPC ...
B32B 5/26 (2006.01); B29C 45/14 (2006.01); B32B 5/02 (2006.01); B32B 5/18 (2006.01); B32B 5/24 (2006.01); B32B 7/12 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B29K 77/00 (2006.01); B29K 309/08 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B32B 5/26 (2013.01); B29C 45/14508 (2013.01); B32B 5/02 (2013.01); B32B 5/18 (2013.01); B32B 5/245 (2013.01); B32B 7/12 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B29K 2077/00 (2013.01); B29K 2309/08 (2013.01); B29L 2031/3481 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); Y10T 428/24777 (2015.01);
Abstract

An integrally molded body has a bonding resin (C) interposed between a board (A) and a member (B), one surface of the board being a design surface, wherein: inside the member (B), a first bonding section disposed to space apart the board (A) and the member (B) and by which at least a partial region of an outer peripheral edge section of the board (A) bonds to the bonding resin (C), is provided; and at least at a part of the design surface-side surface of the integrally molded body, a region where the board (A), the member (B), and the bonding resin (C) are exposed is provided. A plurality of structures can be bonded with high bonding strength and allows for the bonding boundary thereof to have favorable smoothness, thereby making it possible to mitigate warping and reduce weight and thickness even when the molded body has a board constituent member.

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