The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Aug. 18, 2017
Applicant:

Nanobiosys Inc., Seoul, KR;

Inventors:

Sung Woo Kim, Seoul, KR;

Seung Min Jeong, Seoul, KR;

Jae Young Byun, Bucheon-si, KR;

Assignee:

NANOBIOSYS INC., Seoul, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); B01L 7/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/565 (2013.01); B01L 3/502707 (2013.01); B01L 3/502715 (2013.01); B01L 7/525 (2013.01); B01L 7/52 (2013.01); B01L 2200/0684 (2013.01); B01L 2200/0689 (2013.01); B01L 2300/08 (2013.01);
Abstract

Provided is a microfluidic chip having an inlet/outlet structure optimized for sealing an inlet/outlet of a microfluidic chip using a UV curable sealing material, a microfluidic chip having the inlet/outlet structure, and a method of sealing the inlet/outlet of the microfluidic chip using a UV curable sealing material. It is possible to provide a semi-permanent seal with less contamination from a fluid sample or a harmful reagent, and the inlet/outlet of the microfluidic chip can be firmly sealed using simple equipment and without high-temperature/high-pressure conditions. By using the inlet/outlet structure of the microfluidic chip and the sealing method thereof, it is possible not only to improve the accuracy and deviation of the reaction result as the generation of bubbles is suppressed even when a predetermined reaction is performed on the microfluidic chip, but also it is possible to apply a fully automated system by eliminating the need for ancillary equipment such as a chip case and minimizing or eliminating manual operations.


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