The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Jul. 13, 2016
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Yuichi Aki, Tokyo, JP;

Masaru Fujii, Tokyo, JP;

Toshihiro Nakajima, Tokyo, JP;

Masanori Okazaki, Kanagawa, JP;

Tomomi Yukumoto, Chiba, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); G01N 35/08 (2006.01); G01N 37/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B01L 3/50273 (2013.01); B01L 3/502738 (2013.01); G01N 35/08 (2013.01); G01N 37/00 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0887 (2013.01); B01L 2300/123 (2013.01);
Abstract

To provide a high-quality and high-performance micro-channel device which can be manufactured by a simple method. Provided is a micro-channel device used in analyzing a sample. The micro-channel device includes at least two substrates and an elastic film interposed between the two substrates. The substrates are thermally fused to the elastic film in at least a part thereof. Also provided is a method for manufacturing a micro-channel device used in analyzing a sample. The method includes a surface activation step of activating a joining surface of a substrate and/or an elastic film, a lamination step of laminating the elastic film between at least two of the substrates, and a thermal fusion step of thermally fusing the substrates to the elastic film in at least a part thereof.


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