The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Aug. 31, 2018
Applicant:
Asahi Kasei Kabushiki Kaisha, Tokyo, JP;
Inventor:
Daisuke Okamura, Tokyo, JP;
Assignee:
ASAHI KASEI KABUSHIK KASHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 69/08 (2006.01); B01D 71/34 (2006.01); B01D 71/36 (2006.01); B01D 71/76 (2006.01);
U.S. Cl.
CPC ...
B01D 69/08 (2013.01); B01D 71/34 (2013.01); B01D 71/36 (2013.01); B01D 71/76 (2013.01); B01D 2323/08 (2013.01); B01D 2323/12 (2013.01); B01D 2323/18 (2013.01); B01D 2323/20 (2013.01); B01D 2323/22 (2013.01); B01D 2325/026 (2013.01); B01D 2325/20 (2013.01); B01D 2325/24 (2013.01); B01D 2325/30 (2013.01);
Abstract
Provided is a method including the steps of producing a melt-kneaded product and discharging the melt-kneaded product. In the step of producing a melt-kneaded product, a thermoplastic resin, a non-solvent and an inorganic compound are mixed and melt-kneaded, wherein the non-solvent does not uniformly dissolve the thermoplastic resin of one-quarter mass at a boiling point or 250° C., whichever is lower.