The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Sep. 30, 2019
Applicants:

Mitsui Chemicals, Inc., Tokyo, JP;

Sun Medical Co., Ltd., Moriyama, JP;

Inventors:

Kazuhiko Yoshinaga, Ichihara, JP;

Yoshimitsu Tanabe, Ichihara, JP;

Shinsuke Kinoshita, Ichihara, JP;

Takenori Mitamura, Ichihara, JP;

Hiroki Murai, Ichihara, JP;

Takeshi Yokoyama, Moriyama, JP;

Yoshihisa Kamimoto, Moriyama, JP;

Tatsuya Ori, Moriyama, JP;

Hirohisa Shimizu, Moriyama, JP;

Masami Arata, Moriyama, JP;

Masuji Tsuchikawa, Moriyama, JP;

Sayaka Miyamori, Moriyama, JP;

Yoshiaki Katsura, Moriyama, JP;

Assignees:

MITSUI CHEMICALS, INC., Tokyo, JP;

SUN MEDICAL CO., LTD., Moriyama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61K 6/00 (2020.01); A61K 6/30 (2020.01); A61K 6/62 (2020.01); A61K 6/887 (2020.01); C07C 271/20 (2006.01);
U.S. Cl.
CPC ...
A61K 6/30 (2020.01); A61K 6/00 (2013.01); A61K 6/62 (2020.01); A61K 6/887 (2020.01); C07C 271/20 (2013.01); C07C 2602/42 (2017.05);
Abstract

A dental adhesive curable composition containing a polymerizable monomer including a polymerizable monomer represented by formula (1') and defined amounts of an acidic group-containing polymerizable monomer, a polymerization initiator containing a peroxide and a photopolymerization initiator, and a reductant containing a sulfinic acid compound and/or a salt thereof, and a filler: wherein the R groups, n and m are defined. A dental adhesive curable kit and a mobile tooth fixing material are also provided.


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