The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Jul. 18, 2018
Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masato Saito, Tokyo, JP;

Toru Yumoto, Tokyo, JP;

Masanori Tsuruta, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01); H05K 3/02 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); H05K 1/09 (2013.01); H05K 3/02 (2013.01); H05K 3/10 (2013.01); H05K 3/38 (2013.01);
Abstract

Provided is a structure that has highly reliable electroconductive pattern regions, that offers an extremely simple manufacturing process, and that has excellent electrical insulation between the electroconductive pattern regions. This structure () having electroconductive pattern regions is provided with a support (), and, on a surface configured by the support, a layer () in which insulation regions () containing a copper oxide- and phosphorus-containing organic substance and electroconductive pattern regions () containing copper are disposed next to one another. This stack is provided with: a support, a coating layer containing copper oxide and phosphorus and disposed on a surface configured by the support; and a resin layer disposed so as to cover the coating layer.


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