The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Jul. 30, 2019
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Yutaka Yamazaki, Shiojiri, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 3/38 (2006.01); H05K 3/18 (2006.01); C23C 18/30 (2006.01); C23C 18/50 (2006.01); C23C 18/20 (2006.01); H05K 1/03 (2006.01); B32B 15/04 (2006.01);
U.S. Cl.
CPC ...
H05K 3/381 (2013.01); B32B 15/04 (2013.01); C23C 18/204 (2013.01); C23C 18/30 (2013.01); C23C 18/50 (2013.01); H05K 1/03 (2013.01); H05K 3/184 (2013.01); H05K 2203/072 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1105 (2013.01); Y10T 428/24917 (2015.01);
Abstract
A wiring substrate includes a substrate containing a resin as a main component and including a mixed layer in which the resin and a catalyst are mixed together; and a metal wire disposed to cover the mixed layer and being in contact with the catalyst. The wiring substrate with such a configuration can increase the adhesion of the metal wire to the substrate.