The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Mar. 25, 2020
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

DooSub Choi, Daejeon, KR;

Joong-Soo Moon, Asan-si, KR;

Sangmin Kang, Hwaseong-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); G09F 9/30 (2006.01); G02F 1/1345 (2006.01); H01L 27/32 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); G02F 1/13452 (2013.01); G09F 9/301 (2013.01); H01L 27/32 (2013.01); H05K 1/028 (2013.01); H05K 1/147 (2013.01); G02F 2202/28 (2013.01); H01L 2227/32 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A circuit board assembly includes a flexible circuit board including a first surface, a second surface opposite to the first surface, sensing pads on the first surface, and a connector on the second surface, a first liner which includes a first rear surface covering a portion of the first surface and a first top surface that is opposite to the first rear surface and in which a first opening passing through the first rear surface from the first top surface is defined, a second liner which includes a second rear surface covering a portion of the second surface and a second top surface that is opposite to the second rear surface and in which a second opening passing through the second rear surface from the second top surface is defined. Each of the first and second openings is spaced apart from the flexible circuit board in a plan view.


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