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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11109486 B1

PDFFull Text
Date of Patent:
Aug. 31, 2021

Filed:

Oct. 21, 2019

High-speed, flexible integrated circuits and methods for making high-speed, flexible integrated circuits

Applicant:

Wisconsin Alumni Research Foundation, Madison, WI (US);

Inventors:

Zhenqiang Ma, Middleton, WI (US);

Guoxuan Qin, Tianjin, CN;

Namki Cho, Madison, WI (US);

Assignee:

Wisconsin Alumni Research Foundation, Madison, WI (US);

Attorneys:

Bell & Manning, LLC

Michelle Manning

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 7/06 (2006.01); H01L 21/762 (2006.01); H01L 21/764 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H01L 21/6835 (2013.01); H05K 1/185 (2013.01); H05K 3/284 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H05K 2201/0133 (2013.01); H05K 2203/308 (2013.01);
Abstract

The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.

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Ma, Zhenqiang. (2021). High-speed, flexible integrated circuits and methods for making high-speed, flexible integrated circuits (U.S. Patent No. 11109486). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11109486

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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