The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Oct. 21, 2019
Applicant:

Wisconsin Alumni Research Foundation, Madison, WI (US);

Inventors:

Zhenqiang Ma, Middleton, WI (US);

Guoxuan Qin, Tianjin, CN;

Namki Cho, Madison, WI (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 7/06 (2006.01); H01L 21/762 (2006.01); H01L 21/764 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H01L 21/6835 (2013.01); H05K 1/185 (2013.01); H05K 3/284 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H05K 2201/0133 (2013.01); H05K 2203/308 (2013.01);
Abstract

The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.


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