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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11108304 B1

PDFFull Text
Date of Patent:
Aug. 31, 2021

Filed:

May. 23, 2019

Brushless motor assembly

Applicant:

Mobiletron Electronics Co., Ltd., Taichung, TW;

Inventor:

Wen-Shing Hon, Taichung, TW;

Assignee:

MOBILETRON ELECTRONICS CO., LTD., Taichung, TW;

Attorneys:

Tracy M Helms

Apex Jurls, Pllc.

Primary Examiner:

Tran N Nguyen

Int. Cl.
CPC ...
H02K 9/22 (2006.01); H02K 7/14 (2006.01); H02K 9/06 (2006.01); H02K 11/33 (2016.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01); B25F 5/02 (2006.01);
U.S. Cl.
CPC ...
H02K 9/22 (2013.01); H02K 7/145 (2013.01); H02K 9/06 (2013.01); H02K 11/33 (2016.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 7/209 (2013.01); B25F 5/02 (2013.01); H02K 2211/03 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10053 (2013.01);
Abstract

A brushless motor assembly includes a motor body, a circuit board, and a heat sink. The circuit board has a mounting surface and includes a motor control unit and a power switch which are disposed on the mounting surface. The motor control unit is adapted to control an operation of the power switch. The heat sink is disposed between the motor body and the circuit board, wherein the heat sink has a first side portion and a second side portion which are opposite to each other; the first side portion faces the motor body, and the second side portion faces the circuit board and shields the mounting surface of the circuit board. With the aforementioned design, it could effectively protect the electronic components on the circuit board and provide good heat dissipation effect.

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