The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Mar. 11, 2019
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Nobuhiro Yamamoto, Yokohama Kanagawa, JP;

Kiyokazu Ishizaki, Inagi Tokyo, JP;

Kota Tokuda, Kawasaki Kanagawa, JP;

Yousuke Hisakuni, Sagamihara Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/78 (2011.01); G11B 33/14 (2006.01); H01R 12/79 (2011.01); H01R 13/24 (2006.01); H05K 1/11 (2006.01); H01R 12/70 (2011.01);
U.S. Cl.
CPC ...
H01R 12/78 (2013.01); G11B 33/14 (2013.01); H01R 12/79 (2013.01); H01R 13/24 (2013.01); H05K 1/118 (2013.01); H01R 12/707 (2013.01); H05K 2201/056 (2013.01);
Abstract

According to one embodiment, an electronic device includes a housing with a through-hole, a flexible printed circuit inserted through the through hole and including a first connection portion on an inner side of the housing with first connection pads and a second connection portion on an outer side of the housing with second connection pads, a first electrical component in the housing, and a first connector connected to the first electrical component and including connection terminals contacting the first connection pads. A first pad of the first connection pads is greater than other first connection pads.


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