The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Oct. 29, 2019
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Kazuhito Hatta, Fukushima, JP;
Mashio Shibuya, Fukushima, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 50/00 (2021.01); H01M 50/124 (2021.01); B29C 65/18 (2006.01); B29C 65/00 (2006.01); H01M 4/13 (2010.01); H01M 10/04 (2006.01); H01M 10/0525 (2010.01); H01M 10/0565 (2010.01); H01M 10/0587 (2010.01); H01M 50/44 (2021.01); H01M 50/46 (2021.01); H01M 50/116 (2021.01); H01M 50/172 (2021.01); H01M 50/183 (2021.01); H01M 50/411 (2021.01); H01M 50/543 (2021.01); H01M 10/052 (2010.01); H01M 4/06 (2006.01); H01M 4/131 (2010.01); H01M 4/133 (2010.01); H01M 4/62 (2006.01); H01M 4/66 (2006.01); H01M 6/02 (2006.01); H01M 6/16 (2006.01); H01M 6/18 (2006.01); H01M 10/0568 (2010.01); H01M 10/0569 (2010.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B29C 65/02 (2006.01); B29C 65/08 (2006.01); B32B 5/14 (2006.01); B32B 15/085 (2006.01); B32B 15/088 (2006.01); B32B 15/09 (2006.01); B32B 27/34 (2006.01); B29L 31/34 (2006.01); B29K 705/02 (2006.01); B29K 623/00 (2006.01); B29K 655/00 (2006.01); B29L 31/00 (2006.01); B29K 23/00 (2006.01);
U.S. Cl.
CPC ...
H01M 50/124 (2021.01); B29C 65/02 (2013.01); B29C 65/08 (2013.01); B29C 65/18 (2013.01); B29C 66/1122 (2013.01); B29C 66/32 (2013.01); B29C 66/41 (2013.01); B29C 66/433 (2013.01); B29C 66/71 (2013.01); B29C 66/72321 (2013.01); B29C 66/7352 (2013.01); B29C 66/83221 (2013.01); B32B 5/142 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/085 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); H01M 4/06 (2013.01); H01M 4/13 (2013.01); H01M 4/131 (2013.01); H01M 4/133 (2013.01); H01M 4/623 (2013.01); H01M 4/625 (2013.01); H01M 4/661 (2013.01); H01M 6/02 (2013.01); H01M 6/164 (2013.01); H01M 6/166 (2013.01); H01M 6/181 (2013.01); H01M 10/0431 (2013.01); H01M 10/052 (2013.01); H01M 10/0525 (2013.01); H01M 10/0565 (2013.01); H01M 10/0568 (2013.01); H01M 10/0569 (2013.01); H01M 10/0587 (2013.01); H01M 50/116 (2021.01); H01M 50/172 (2021.01); H01M 50/183 (2021.01); H01M 50/411 (2021.01); H01M 50/44 (2021.01); H01M 50/46 (2021.01); H01M 50/543 (2021.01); B29C 66/81431 (2013.01); B29K 2023/12 (2013.01); B29K 2623/12 (2013.01); B29K 2655/00 (2013.01); B29K 2705/02 (2013.01); B29L 2031/3468 (2013.01); B29L 2031/7146 (2013.01); B32B 2250/03 (2013.01); B32B 2255/06 (2013.01); B32B 2274/00 (2013.01); B32B 2323/10 (2013.01); B32B 2367/00 (2013.01); B32B 2457/10 (2013.01); B32B 2553/00 (2013.01); H01M 2220/30 (2013.01); H01M 2300/0037 (2013.01); H01M 2300/0082 (2013.01); Y02E 60/10 (2013.01);
Abstract
A method of forming a package is provided and includes providing two laminate edge portions of the package, each of which includes a foil layer between first and second resin layers; and welding together the respective first resin layers at a first position spaced apart from the edges while not welding the respective first resin layers at the edges, wherein the edge portions include edges from which electrode terminals extend such that portions of the electrode terminals are exposed beyond the edges, and wherein the edge portions are between a sealing portion and exposed portions of positive and negative electrode terminals.