The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Feb. 23, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Tetsuro Hayashida, Tokyo, JP;

Takuma Nanjo, Tokyo, JP;

Tatsuro Watahiki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/22 (2006.01); H01L 29/201 (2006.01);
U.S. Cl.
CPC ...
H01L 29/22 (2013.01); H01L 29/201 (2013.01);
Abstract

A semiconductor device includes a supporting substrate, a first GaN layer of a first conductivity type provided on the side of a first main surface of the supporting substrate, a second GaN layer of the first conductivity type provided on the first GaN layer, an AlxGa1−xN layer provided on the second GaN layer, a third GaN layer of a second conductivity type provided on the AlxGa1−xN layer, a fourth GaN layer of the first conductivity type provided on the third GaN layer, an insulating film covering a top of the fourth GaN layer, a trench gate reaching the inside of the second GaN layer, a gate electrode, a first main electrode connected to the third GaN layer, and a second main electrode, and the donor concentration of the third GaN layer is lower than that of the fourth GaN layer.


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