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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11107855 B1

PDFFull Text
Date of Patent:
Aug. 31, 2021

Filed:

Aug. 28, 2019

Method for bonding and connecting substrates

Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Nobutoshi Fujii, Kanagawa, JP;

Yoshiya Hagimoto, Kanagawa, JP;

Kenichi Aoyagi, Kanagawa, JP;

Yoshihisa Kagawa, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:

Sheridan Ross P.C

Primary Examiner:

Daniel Luke

Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/20 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1469 (2013.01); H01L 21/2007 (2013.01); H01L 21/76823 (2013.01); H01L 21/76828 (2013.01); H01L 21/76864 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 27/1464 (2013.01); H01L 27/14612 (2013.01); H01L 27/14618 (2013.01); H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 27/14689 (2013.01); H04N 5/2254 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05547 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/0807 (2013.01); H01L 2224/08147 (2013.01); H01L 2224/08501 (2013.01); H01L 2224/80035 (2013.01); H01L 2224/8083 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80935 (2013.01); H01L 2224/80986 (2013.01);
Abstract

A semiconductor device includes a first substrate having an attaching surface on which first electrodes and a first insulating film are exposed, an insulating thin film that covers the attaching surface of the first substrate, and a second substrate which has an attaching surface on which second electrodes and a second insulating film are exposed and is attached to the first substrate in a state in which the attaching surface of the second substrate and the attaching surface of the first substrate are attached together sandwiching the insulating thin film therebetween, and the first electrodes and the second electrodes deform and break a part of the insulating thin film so as to be directly electrically connected to each other.

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