The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Sep. 27, 2019
Applicant:
SK Hynix Inc., Gyeonggi-do, KR;
Inventors:
Assignee:
SK hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/481 (2013.01); H01L 23/49513 (2013.01); H01L 23/49816 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16145 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A semiconductor module includes a module board, an interposer on the module board, and a processing device and a memory stack that are disposed side by side on the interposer, wherein the memory stack includes a base die, and a memory die on the base die, wherein the memory die includes an outer bank region, a central TSV region, first and second inner bank regions, and a first non-central TSV region, wherein the central TSV region is disposed between the outer bank region and the second inner bank region, and the first non-central TSV region is disposed between the first inner bank region and the second inner bank region.