The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Mar. 27, 2017
Mitsui Chemicals Tohcello, Inc., Tokyo, JP;
Eiji Hayashishita, Nagoya, JP;
MITSUI CHEMICALS TOHCELLO, INC., Tokyo, JP;
Abstract
A method for manufacturing a semiconductor device according to the present invention includes at least the following three steps: (A) a step of preparing a first structure () including an adhesive laminate film () having a heat-resistant resin layer (), a flexible resin layer () and an adhesive resin layer () in this order, and a first semiconductor component () adhered to the adhesive resin layer () and having a first terminal (); (B) a step of performing solder reflow processing on the first structure () in a state where the first semiconductor component () is adhered to the adhesive resin layer (); and (C) a step of, after the step (B), peeling the heat-resistant resin layer () from the adhesive laminate film ().