The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Aug. 28, 2019
Toshiba Memory Corporation, Tokyo, JP;
Masaya Shima, Yokkaichi Mie, JP;
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Abstract
According to one embodiment, a method of manufacturing a semiconductor device includes: forming a semiconductor feature on a first surface of a substrate; forming a first insulating film on the semiconductor feature; forming a first wiring layer on the first insulating film; forming a second insulating film on the first wiring layer; forming a second wiring layer on the second insulating film; forming a first electrode on the second wiring layer; providing a protective adhesive that covers the first electrode and the second wiring layer; bonding a supporting substrate onto the protective adhesive; polishing a second surface of the substrate opposite to the first surface; removing the supporting substrate from the protective adhesive; and removing at least a portion of the protective adhesive to expose the first electrode.