The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Nov. 08, 2018
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Shinji Sano, Matsumoto, JP;

Yoshihiro Kodaira, Matsumoto, JP;

Masayuki Soutome, Matsumoto, JP;

Kazunaga Onishi, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/48 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/27 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/3735 (2013.01); H01L 23/48 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 21/4875 (2013.01); H01L 2224/2712 (2013.01); H01L 2224/2746 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2969 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/29561 (2013.01); H01L 2224/321 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32501 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/83065 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83395 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/014 (2013.01);
Abstract

A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder.


Find Patent Forward Citations

Loading…