The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11107749 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 31, 2021

Filed:

Feb. 13, 2019
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Inventors:

Naotaka Taniguchi, Toyota, JP;

Akihiro Ozeki, Chiryu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/467 (2006.01); H01L 23/367 (2006.01); H02M 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/467 (2013.01); H01L 23/3672 (2013.01); H02M 1/00 (2013.01);
Abstract

A heat dissipation fin structure includes a plurality of fins provided on a surface of a fin base plate. The fins configure a plurality of flow passages in which cooling air that enters from an inlet passes. The fins include a first fin, and an end portion of the first fin on an inlet side is arranged in an intermediate part of a first flow passage that is formed between a pair of the fins. The first flow passage is divided by the first fin into a second flow passage and a third flow passage. An interval between the pair of fins is wider on an outlet side than the inlet side. A sectional area of the first flow passage is substantially equal to a sum of sectional areas of the second flow passage and the third flow passage.


Find Patent Forward Citations

Taniguchi, Naotaka. (2021). Heat dissipation fin structure and cooling structure for electric substrate using the same (U.S. Patent No. 11107749). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11107749

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