The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Feb. 09, 2016
Mitsubishi Electric Corporation, Tokyo, JP;
Hiroshi Kawashima, Tokyo, JP;
Takamasa Iwai, Tokyo, JP;
Taketoshi Shikano, Tokyo, JP;
Satoshi Kondo, Tokyo, JP;
Ken Sakamoto, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A lead frame () includes an inner lead (), an outer lead () connected to the inner lead (), and a power die pad (). A power semiconductor device () is bonded onto the power die pad (). A first metal thin line () electrically connects the inner lead () and the power semiconductor device (). Sealing resin () seals the inner lead (), the power die pad (), the power semiconductor device (), and the first metal thin line (). The sealing resin () includes an insulating section () directly beneath the power die pad (). A thickness of the insulating section () is 1 to 4 times a maximum particle diameter of inorganic particles in the sealing resin (). A first hollow () is provided on an upper surface of the sealing resin () directly above the power die pad () in a region without the first metal thin line () and the power semiconductor device ().