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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11107741 B1

PDFFull Text
Date of Patent:
Aug. 31, 2021

Filed:

Aug. 15, 2019

Composite ceramic multilayer substrate, heat generating element-mounting module, and method of producing composite ceramic multilayer substrate

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Tomoki Kato, Nagaokakyo, JP;

Yasutaka Sugimoto, Nagaokakyo, JP;

Yoichi Moriya, Nagaokakyo, JP;

Takahiro Hayakawa, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Seth Dumbris

Int. Cl.
CPC ...
B32B 3/00 (2006.01); H01L 23/15 (2006.01); C04B 41/50 (2006.01); C04B 41/87 (2006.01); H01L 23/13 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); F28F 21/04 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); C04B 41/5059 (2013.01); C04B 41/5066 (2013.01); C04B 41/87 (2013.01); F28F 21/04 (2013.01); H01L 21/4882 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 24/32 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H05K 1/0201 (2013.01); H05K 1/0306 (2013.01); H05K 3/4629 (2013.01); H01L 2224/32237 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1426 (2013.01);
Abstract

A composite ceramic multilayer substrate includes a glass ceramic insulating layer including a wiring layer and a highly thermally conductive ceramic insulating layer made of a ceramic material having a higher thermal conductivity than the glass ceramic insulating layer. The glass ceramic insulating layer is provided on at least one main surface of the highly thermally conductive ceramic insulating layer directly and/or with a wiring layer interposed therebetween. When viewed in a direction perpendicular or substantially perpendicular to a main surface of the composite ceramic multilayer substrate, the composite ceramic multilayer substrate includes at least one heat generating element-mounting portion surrounded by the glass ceramic insulating layer and at which a heat generating element-mounting wiring line provide on the main surface of the highly thermally conductive ceramic insulating layer is exposed.

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