The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Sep. 26, 2019
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Hubei, CN;
Yan Xie, Hubei, CN;
Xuanjun Liu, Hubei, CN;
Abstract
A method for manufacturing a semiconductor device is provided. A substrate is provided, where a cover layer is formed on the substrate, a wiring layer is formed in the cover layer, a layer to be etched is formed on the cover layer, and the layer to be etched includes an adhesive layer. An exposure patterned film layer is formed on the layer to be etched. A first etching hole pattern is formed in the exposure patterned film layer. The layer to be etched is etched to form a blind hole by using the exposure patterned film layer as a mask. The exposure patterned film layer is trimmed to form a second etching hole pattern. The layer to be etched is further etched to form a bonding hole by using the trimmed exposure patterned film layer as a mask. A bonding pad is formed in the bonding hole.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile