The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Oct. 29, 2019
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Li-Wen Chang, Campbell, CA (US);

Ping-Chin Yeh, San Jose, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/02 (2006.01); H01L 21/3115 (2006.01); H01L 21/265 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31155 (2013.01); H01L 21/26586 (2013.01); H01L 21/311 (2013.01); H01L 21/76829 (2013.01);
Abstract

Examples described herein provide for methods for semiconductor processing for forming source/drain regions of transistors. An example is a method for semiconductor processing. An etch stop liner is formed in a semiconductor substrate. Forming the etch stop liner includes implanting etch selectivity dopants into the semiconductor substrate. The etch selectivity dopants form at least part of the etch stop liner. A source/drain cavity is formed in the semiconductor substrate. Forming the source/drain cavity includes etching the etch stop liner. Etching the etch stop liner selectively etches the etch stop liner relative to a material of the semiconductor substrate. A source/drain region is epitaxially grown in the source/drain cavity.


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