The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
May. 24, 2018
Applicant:
Sumida Corporation, Tokyo, JP;
Inventors:
Juichi Oki, Natori, JP;
Tomohiro Kajiyama, Natori, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/04 (2006.01); H01F 41/00 (2006.01); H01F 41/02 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 41/04 (2013.01); H01F 41/005 (2013.01); H01F 41/0246 (2013.01); H01F 2017/048 (2013.01);
Abstract
A mold apparatus is provided for manufacturing a coil component. The mold apparatus includes a support plate, a die on the support plate, a lid, and a press member that presses the lid toward the support plate. The die has a peripheral side wall defining an opening opposite the support plate. The coil component is placeable in an inner space of the die interior of the side wall. The lid is insertable via the opening into the inner space with an outer peripheral edge of the lid slidably received by the side wall of the die.