The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Jun. 13, 2020
Applicant:

Huazhong University of Science and Technology, Hubei, CN;

Inventors:

Wenlong Li, Hubei, CN;

Cheng Jiang, Hubei, CN;

Gang Wang, Hubei, CN;

Zelong Peng, Hubei, CN;

Han Ding, Hubei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06K 9/46 (2006.01); G06K 9/62 (2006.01);
U.S. Cl.
CPC ...
G06K 9/4604 (2013.01); G06K 9/00664 (2013.01); G06K 9/6202 (2013.01);
Abstract

The disclosure discloses a method for extracting a boundary of a thin-walled part with small curvature based on three-dimensional point cloud. The method includes: collecting point cloud data of a part to reduce density of the point cloud data, performing Euclidean cluster to divide into point cloud pieces, obtaining triangular mesh surfaces for each point cloud triangulation; extracting a boundary vertex of each triangular mesh surface to obtain a contour thereof, selecting a contour of the part among all contours; searching with each point on the contour as a center to form a three-dimensional boundary point cloud band; projecting the three-dimensional boundary point cloud band to a plane, orderly extracting two-dimensional boundary points within the plane, and arranging corresponding points in the three-dimensional boundary point cloud band according to an order of ordered boundary points within the plane to obtain ordered boundary points in the three-dimensional boundary point cloud band.


Find Patent Forward Citations

Li, Wenlong. (2021). Method for extracting robot processing boundary of thin-walled part with small curvature based on three-dimensional point cloud (U.S. Patent No. 11106932). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11106932

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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