The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Aug. 20, 2019
Applicant:

Zhejiang University, Zhejiang, CN;

Inventors:

Yanguo Zhou, Zhejiang, CN;

Kai Liu, Zhejiang, CN;

Qiang Ma, Zhejiang, CN;

Xinhui Zhou, Zhejiang, CN;

Assignee:

ZHEJIANG UNIVERSITY, Zhejiang, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E02D 27/34 (2006.01); E02D 3/08 (2006.01); E02D 3/12 (2006.01); E02D 31/02 (2006.01);
U.S. Cl.
CPC ...
E02D 27/34 (2013.01); E02D 3/08 (2013.01); E02D 3/123 (2013.01); E02D 31/02 (2013.01);
Abstract

The disclosure discloses a high-performance liquefaction mitigation method forstone columns for protecting the existing buildings during earthquakes. Specifically, a small equipment is used to dig trenches in the soil around the existing building. Then, a spiral driller is used to drill a series of boreholes in the trenches according to the optimized borehole design. Next, two or three layers of optimized gravel material with high permeability are filled into the boreholes to work as the inverted layer. Finally, geotextile is arranged around the trench and the trench is filled with the optimized gravel. Compared with current liquefaction mitigation methods for existing buildings, the disclosure is suitable for liquefaction mitigation in large cities, and has the advantages of low disturbance to the overlaid building, simple construction process, high construction efficiency, low construction cost, long service life and the construction material could be easily obtained.


Find Patent Forward Citations

Loading…