The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Feb. 12, 2018
Seoul National University R&db Foundation, Seoul, KR;
Kooknoh Yoon, Seoul, KR;
Il-Hwan Kim, Seoul, KR;
Hyun Seok Oh, Seoul, KR;
Sang Jun Kim, Seoul, KR;
Eun Soo Park, Suwon-si, KR;
SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION, Seoul, KR;
Abstract
A bi-continuous composite of a refractory alloy and copper, and a method for manufacturing the same, are provided. The method for manufacturing a bi-continuous composite of a refractory alloy and copper includes: providing an alloy melt swapping (AMS) precursor; providing a copper melt with a temperature in a range of 1085° C. to 3410° C.; immersing the AMS precursor into the copper melt; and removing the AMS precursor from the copper melt. The AMS precursor includes elements having positive and negative mixing enthalpy with copper, respectively. The AMS precursor into which the copper melt is diffused becomes a bi-continuous composite with a first phase formed from the copper and a second phase formed from the AMS precursor.