The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Aug. 26, 2016
Applicant:
Toyobo Co., Ltd., Osaka, JP;
Inventors:
Takuya Yokomichi, Hyogo, JP;
Kenji Kashihara, Hyogo, JP;
Assignee:
TOYOBO CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 123/12 (2006.01); C09J 7/35 (2018.01); C09J 123/04 (2006.01); B32B 27/32 (2006.01); B32B 27/00 (2006.01); C09J 123/14 (2006.01); C09J 123/26 (2006.01); C09J 7/29 (2018.01);
U.S. Cl.
CPC ...
C09J 123/12 (2013.01); B32B 27/00 (2013.01); B32B 27/32 (2013.01); C09J 7/29 (2018.01); C09J 7/35 (2018.01); C09J 123/04 (2013.01); C09J 123/14 (2013.01); C09J 123/26 (2013.01); C08L 2205/03 (2013.01);
Abstract
The present invention provides an adhesive composition and a hot-melt adhesive that are suitably used for bonding a polyolefin resin substrate and a polar material, and that are capable of low-temperature adhesion. The adhesive composition comprises an acid-modified polypropylene (A), an unfunctionalized polypropylene (B), and a polyethylene (C), and has a melting point of 70 to 140° C.