The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Jun. 29, 2018
Applicant:

Dow Silicones Corporation, Midland, MI (US);

Inventors:

Qing Cao, Shanghai, CN;

Yan Zhou, Shanghai, CN;

Chao Ma, Shanghai, CN;

Assignee:

Dow Silicones Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 183/04 (2006.01); C09J 7/38 (2018.01); C09J 11/06 (2006.01); C09J 5/02 (2006.01);
U.S. Cl.
CPC ...
C09J 7/381 (2018.01); C09J 5/02 (2013.01); C09J 11/06 (2013.01); C09J 183/04 (2013.01); C09J 2203/326 (2013.01); C09J 2301/312 (2020.08);
Abstract

A solventless silicone pressure sensitive adhesive composition includes: (A) a polydiorganosiloxane having a monovalent hydrocarbon group with terminal aliphatic unsaturation, (B) a branched polyorganosiloxane having a monovalent hydrocarbon group with terminal aliphatic unsaturation, (C) a polyorganosilicate resin, (D) an olefinic reactive diluent, (E) a polyorganohydrogensiloxane, (F) a hydrosilylation reaction catalyst, and (G) an anchorage additive. This solventless silicone pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.


Find Patent Forward Citations

Loading…