The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Oct. 27, 2017
Applicant:

Evonik Operations Gmbh, Essen, DE;

Inventors:

Sergey Evsyukov, Ludwigshafen, DE;

Tim Pohlmann, Nidderau, DE;

Horst Stenzenberger, Heidelberg, DE;

Matthijs Ter Wiel, Dossenheim, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 222/40 (2006.01); C07C 43/263 (2006.01); C07C 43/275 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08F 222/40 (2013.01); C07C 43/263 (2013.01); C07C 43/275 (2013.01); C08J 5/24 (2013.01); C08F 222/408 (2020.02); C08F 2810/20 (2013.01); C08J 2335/08 (2013.01);
Abstract

The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein Rsignifies an 1-alkenyl- or 2-alkenyl group with 3 to 6 carbon atoms, wherein Rsignifies hydrogen or an alkoxy group with up to 2 carbon atoms, wherein Rsignifies hydrogen or an alkyl group with up to 4 carbon atoms, and wherein Rsignifies hydrogen or an alkyl group with up to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.


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