The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Apr. 22, 2013
Applicant:
Epcos Ag, Munich, DE;
Inventors:
Marion Ottlinger, Deutschlandsberg, AT;
Marlene Fritz, Graz, AT;
Assignee:
EPCOS AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/00 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); B32B 18/00 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01); H01L 41/083 (2006.01); C04B 37/00 (2006.01); H01L 41/273 (2013.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
B32B 38/0036 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); B32B 18/00 (2013.01); C04B 37/006 (2013.01); H01B 1/026 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1245 (2013.01); H01G 4/30 (2013.01); H01L 41/0838 (2013.01); H01L 41/273 (2013.01); B32B 2305/80 (2013.01); B32B 2307/204 (2013.01); B32B 2311/12 (2013.01); B32B 2457/00 (2013.01); B32B 2457/16 (2013.01); C04B 2237/124 (2013.01); C04B 2237/60 (2013.01); Y10T 428/31678 (2015.04);
Abstract
A multi-layered structural element and a method for producing a multi-layered structural element are disclosed. In an embodiment dielectric green sheets, at least one ply containing an auxiliary material which contains at least one copper oxide and layers containing electrode material are provided and arranged alternately one above another. These materials are debindered and sintered. The copper oxide is reduced to form the copper metal and the at least one ply is degraded during debindering and sintering.