The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
May. 26, 2017
Beijing University of Chemical Technology, Beijing, CN;
Darning Wu, Beijing, CN;
Xiaolong Gao, Beijing, CN;
Ying Liu, Beijing, CN;
Xiuting Zheng, Beijing, CN;
Yao Huang, Beijing, CN;
Hong Xu, Beijing, CN;
Jingyao Sun, Beijing, CN;
Zhongli Zhao, Beijing, CN;
Abstract
The present invention relates to a method for preparing high performance polymer-based conductive composites by space-limited micro-nano precision assembly method, which belongs to the technical field of composite material preparation; including the following steps: (1) through blending the conductive filler and the polymer matrix which are added to the blending equipment, homogeneous polymer/conductive filler material system is obtained; (2) add the homogeneous material system to the mold composed of two flat plates, and let the homogeneous blend gets plane limited compression by means of mechanical compression; (3) making use of the micro-nano structure array set on the compression template to further compact the filler on the network and conducting 'array anchorage', to realize the micro-nano precision assembly of network and obtain the composite material with excellent performance, which has a continuous and tight conductive network, and has excellent tensile properties, flexibility and thermal stability.