The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Dec. 27, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01); H01Q 7/00 (2006.01); H01Q 7/06 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/245 (2006.01); H01F 27/255 (2006.01); H01F 41/00 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H01F 41/06 (2016.01); H01F 41/24 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/165 (2013.01); H05K 1/115 (2013.01); H05K 3/4644 (2013.01); H05K 2201/086 (2013.01);
Abstract
A printed circuit board includes a core layer having a through portion, a magnetic member disposed in the through portion and comprising a magnetic layer, a first coil pattern attached to one surface of the magnetic layer via an adhesive, and a first build-up layer covering at least a portion of the core layer, at least a portion of the magnetic member, and at least a portion of the first coil pattern, and disposed in at least a portion of the through portion.