The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Aug. 31, 2020
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Atsushi Kasuya, Nagaokakyo, JP;
Yusuke Kamitsubo, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/0213 (2013.01); H05K 1/0298 (2013.01); H05K 1/05 (2013.01); H05K 1/14 (2013.01);
Abstract
A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.