The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Nov. 07, 2018
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Jung Hyeong Ha, Seoul, KR;

Sung-Hun Sim, Seoul, KR;

Hyo Jin An, Seoul, KR;

Jongseong Ji, Seoul, KR;

Yun Byung Chae, Seoul, KR;

Assignee:

LG Electronics Inc., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 6/68 (2006.01); H05B 6/70 (2006.01); H05B 6/72 (2006.01); H05B 6/64 (2006.01); H05B 6/66 (2006.01);
U.S. Cl.
CPC ...
H05B 6/687 (2013.01); H05B 6/664 (2013.01); H05B 6/686 (2013.01); H05B 6/72 (2013.01); H05B 2206/044 (2013.01);
Abstract

A microwave heating system includes: a power supply; a first semiconductor module configured to receive power from the power supply and to generate a first microwave; a second semiconductor module configured to receive power from the power supply and to generate a second microwave; a heating chamber that is configured to accommodate an object at an inside of the heating chamber and that allows transmission of the first microwave and the second microwave to the inside of the heating chamber; and a control unit. The control unit is configured to control operation of each of the first semiconductor module and the second semiconductor module, and to control at least one of a frequency, a phase, or a magnitude of each of the first microwave and the second microwave to increase a heating uniformity of the object.


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