The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Nov. 19, 2018
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Grace L. Duncan, Seattle, WA (US);

Damien O. Martin, Everett, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); H01R 4/72 (2006.01); G01B 11/08 (2006.01); H01B 13/00 (2006.01); H01B 13/06 (2006.01); H01R 43/02 (2006.01);
U.S. Cl.
CPC ...
H01R 4/723 (2013.01); G01B 11/08 (2013.01); H01B 13/0036 (2013.01); H01B 13/062 (2013.01); H01B 13/067 (2013.01); H01R 43/0242 (2013.01); H01R 43/0263 (2013.01);
Abstract

An apparatus that melts and monitors sleeves for installation onto shielded cables. The apparatus includes a heat source for melting the sleeve, cable supports for supporting the cable during the melting process, a sensor system that is configured to measure a dimension of the sleeve during melting, and a computer that is connected to receive sensor data from the sensor system and send heater control signals to the heat source. The computer is configured to receive dimensional data from the sensor system, monitor that dimensional data by performing a dimensional analysis, and then deactivate or remove the heat source in response to dimensional analysis results indicating that the sleeve is fully melted (in the case of a solder sleeve) or only fully shrunken (in the case of a dead end sleeve) onto the cable.


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