The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Mar. 22, 2017
Applicant:

Toyo Seikan Group Holdings, Ltd., Tokyo, JP;

Inventors:

Toshihiko Miyazaki, Osaka, JP;

Hirohisa Masuda, Osaka, JP;

Hiroshi Shimomura, Osaka, JP;

Kouji Nanbu, Kudamatsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 27/00 (2006.01); H01L 51/00 (2006.01); C03C 3/066 (2006.01); C03C 3/068 (2006.01); C03C 3/14 (2006.01); C03C 8/04 (2006.01); C03C 8/16 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 51/44 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); C03C 3/066 (2013.01); C03C 3/068 (2013.01); C03C 3/14 (2013.01); C03C 8/04 (2013.01); C03C 8/16 (2013.01); H01L 51/5234 (2013.01); H01L 51/56 (2013.01); C03C 2207/00 (2013.01); H01L 51/44 (2013.01); H01L 2251/301 (2013.01); H01L 2251/303 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/558 (2013.01); Y10T 428/12618 (2015.01);
Abstract

A substrate for flexible device. The substrate has a nickel-plated metal sheet having a nickel-plating layer formed on at least one surface of a metal sheet or a nickel-based sheet, and a glass layer of an electrically-insulating layered bismuth-based glass on a surface of the nickel-plating layer or the nickel-based sheet. An oxide layer having a roughened surface is formed on the surface of the nickel-plating layer or the surface of the nickel-based sheet, and the bismuth-based glass contains 70 to 84% by weight of BiO, 10 to 12% by weight of ZnO, and 6 to 12% by weight of BO. Also disclosed is a method for producing the substrate for flexible device, a substrate for an organic EL device, a sheet used as a substrate for flexible device, a method for producing the sheet and a bismuth-based lead-free glass composition.


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