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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11101395 B1

PDFFull Text
Date of Patent:
Aug. 24, 2021

Filed:

Jul. 06, 2015

Wiring module

Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Kazumasa Toya, Osaka, JP;

Takashi Iwasaki, Osaka, JP;

Youichi Nagai, Osaka, JP;

Koji Mori, Osaka, JP;

Kenji Saito, Osaka, JP;

Rui Mikami, Osaka, JP;

Takeshi Yamana, Osaka, JP;

Assignee:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Attorneys:

Baker Botts L.L.P.

Michael A. Sartori

Primary Examiner:

Michael Y Sun

Int. Cl.
CPC ...
H01L 31/05 (2014.01); H01L 31/0392 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H02S 40/22 (2014.01); H02S 20/32 (2014.01); H02S 30/10 (2014.01); H01L 31/02 (2006.01); H01L 31/054 (2014.01); H02S 40/42 (2014.01); H05K 1/00 (2006.01); H05K 3/36 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 31/03926 (2013.01); H01L 31/02013 (2013.01); H01L 31/0508 (2013.01); H01L 31/0543 (2014.12); H02S 20/32 (2014.12); H02S 30/10 (2014.12); H02S 40/22 (2014.12); H02S 40/42 (2014.12); H05K 1/028 (2013.01); H05K 1/189 (2013.01); H05K 1/00 (2013.01); H05K 3/00 (2013.01); H05K 3/36 (2013.01); H05K 3/40 (2013.01); H05K 2201/046 (2013.01); H05K 2201/05 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/20 (2013.01); Y02E 10/52 (2013.01);
Abstract

This wiring module includes: a wiring substrate; a base portion at which the wiring substrate is placed; and an adhesive layer configured to adhere the wiring substrate to the base portion, wherein the wiring substrate includes: a land portion configured to have a power generating element mounted thereto; and a wire portion configured to be electrically connected to the power generating element, the adhesive layer has: a land adhesion region configured to adhere the land portion to the base portion; and a wire adhesion region configured to adhere the wire portion to the base portion, and a width of the wire adhesion region is smaller than a width of the land adhesion region.

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