The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Dec. 13, 2019
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Toshinobu Miyagoshi, Tokyo, JP;
Seijiro Sunaga, Tokyo, JP;
Osamu Shindo, Tokyo, JP;
Yasuo Kato, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); H01L 27/15 (2006.01); C09J 201/00 (2006.01); H01L 33/00 (2010.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); C09J 201/00 (2013.01); H01L 33/0095 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); C09J 2301/416 (2020.08); C09J 2301/502 (2020.08); Y10S 156/924 (2013.01); Y10S 156/931 (2013.01); Y10S 156/937 (2013.01); Y10S 156/941 (2013.01); Y10S 156/942 (2013.01); Y10T 156/1137 (2015.01); Y10T 156/1158 (2015.01); Y10T 156/1917 (2015.01); Y10T 156/1939 (2015.01);
Abstract
In a method of manufacturing an element array, prepared is an adhesive sheet in which elements are arranged in a predetermined array on an adhesive layer. A specific element among the arrayed elements is removed from the adhesive sheet by radiating a laser to the specific element. The arrayed elements are directly or indirectly transferred onto a mounting substrate.