The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Feb. 22, 2019
Applicants:
Guy Koren, Rishon Lezion, IL;
Ben Rubovitch, Modiin, IL;
Inventors:
Guy Koren, Rishon Lezion, IL;
Ben Rubovitch, Modiin, IL;
Assignees:
DustPhotonics Ltd., Modiin, IL;
XSIGHT LABS LTD., Kyriat Gat, IL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/367 (2013.01); H01L 24/17 (2013.01); H01L 2223/6694 (2013.01); H01L 2924/15321 (2013.01);
Abstract
A method and a high-frequency module that includes a high frequency die that may include multiple die pads; a substrate that may include a first buildup layer, a second buildup layer and a core that is positioned between the first buildup layer and a second buildup layer; a line card that may include multiple line card pads; and multiple conductors that pass through the substrate without reaching a majority of a depth of the core, and couple the multiple die pads to the multiple line card pads.