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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11101225 B1

PDFFull Text
Date of Patent:
Aug. 24, 2021

Filed:

Feb. 09, 2017

Semiconductor device and power conversion device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Hiroyuki Harada, Tokyo, JP;

Naoki Yoshimatsu, Tokyo, JP;

Osamu Usui, Tokyo, JP;

Yuji Imoto, Tokyo, JP;

Yuki Yoshioka, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Omar F Mojaddedi

Int. Cl.
CPC ...
H01L 23/057 (2006.01); H01L 23/047 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/24 (2006.01); H01L 23/373 (2006.01); H01L 23/36 (2006.01); H01L 23/28 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/047 (2013.01); H01L 23/3142 (2013.01); H01L 23/4951 (2013.01); H01L 23/4952 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H02P 27/08 (2013.01);
Abstract

A semiconductor chip () is disposed on the insulation substrate (). A lead frame () is bonded to an upper surface of the semiconductor chip (). A sealing resin () covers the semiconductor chip (), the insulation substrate (), and the lead frame (). A stress mitigation resin () having a lower elastic modulus than that of the sealing resin () is partially applied to an end of the lead frame ().

Find Patent Forward Citations

Harada, Hiroyuki. (2021). Semiconductor device and power conversion device (U.S. Patent No. 11101225). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11101225

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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