The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Jan. 28, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Baozhen Li, South Burlington, VT (US);

Chih-Chao Yang, Glenmont, NY (US);

Jim Shih-Chun Liang, Poughkeepsie, NY (US);

Tian Shen, Clifton Park, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01);
Abstract

An eFuse structure including a semiconductor substrate; back end of the line (BEOL) metallization levels on the semiconductor substrate; vias extending through the metallization levels; at least one of the metallization levels including one or more metallic plates in electrical contact with one of the vias, the one or more metallic plates having at least one fusible link in electrical contact with one or more additional vias. The eFuse structure may form a multi-fuse structure such that each fusible link may be fused separately or together at the same time.


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