The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Mar. 01, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Saburo Tanaka, Tokyo, JP;

Tatsuya Fukase, Tokyo, JP;

Masaki Kato, Tokyo, JP;

Norio Emi, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/62 (2006.01); H01L 23/29 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 23/29 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/62 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40245 (2013.01); H01L 2924/181 (2013.01);
Abstract

A power semiconductor device is such that a notch provided, along a longitudinal end face of an inner lead, in a region of a lead frame to which the inner lead is bonded. A resistor is disposed, adjacent to the inner lead, on the same side as the notch with respect to the inner lead, and a distance between the inner lead and the notch is set to be smaller than a distance between the inner lead and the resistor, and thereby the inner lead, even when shifted in position, comes into no contact with the resistor. Because of this, it is no more necessary that a space be provided around the inner lead taking into consideration a positional shift of the inner lead, and it is possible to secure the heat release area of power semiconductor chips accordingly, and thus to obtain the small-sized and high-powered power semiconductor device.


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