The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Feb. 28, 2020
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/38 (2006.01); H01L 23/433 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49517 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/38 (2013.01); H01L 23/4093 (2013.01); H01L 23/4334 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48247 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/181 (2013.01);
Abstract
In one general aspect, an apparatus can include a semiconductor die, a substrate, and a leadframe coupled to the substrate and defining an opening. The apparatus can include a one-body clip having a first portion disposed within the opening and coupled to the semiconductor die. The one-body clip can have a second portion disposed within the same opening and coupled to the substrate.